LSI Correlator.

Abstract

The integrated circuit test pattern, CTP, was fabricated to demonstrate the integrability and performance of one correlator bit, associated clock drivers, voltage reference sources, and numerous test devices. The initial run encountered a p-type contamination in the buried layer antimony source which prevented the Schottky diodes from operating and produced very low f sub T devices. Correcting this problem resulted in good quality Schottky diodes and very high values of f sub T. Testing of these circuits and test devices has begun. The relative yield and high speed performance of four types of correlator bits are being evaluated, with or without Schottky diodes and with thin film or silicon resistors. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1970
Accession Number
AD0865810

Entities

Organizations

  • TRW Inc.

Tags

DTIC Thesaurus Topics

  • Antimony
  • Circuits
  • Contamination
  • Correlators
  • Diodes
  • Electronic Equipment
  • Films
  • Integrated Circuits
  • Resistors
  • Schottky Diodes
  • Thin Films

Readers

  • Aerospace Test and Evaluation
  • Electronics Engineering
  • Parallel and Distributed Computing.