Manufacturing Methods Applicable to Memory System for Microcircuits.
Abstract
Efforts to establish manufacturing methods for producing a compact, low power, modular memory system are described. The memory uses vacuum deposited MATED FILM storage elements, vacuum evaporated wiring and insulation, integrated circuits ultrasonically face-down bonded to evaporated wiring, and reflow soldered and/or welded copper-Mylar interconnections. The design, fabrication, and test of the memory system is reported. The equipment and methods used for MATED FILM deposition, vacuum evaporation, integrated circuit test, face-down bonding, and copper-Mylar reflow soldering and/or welding are described. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1969
- Accession Number
- AD0867784
Entities
People
- A. A. Adomines
- A. D. Kaske
- G. Held
- J. Martino
- S. Ohnigian
Organizations
- Sperry Corporation