Improving Strip-Line Packages by the Use of Bonding Techniques,

Abstract

The potential advantages and disadvantages of bonding strip transmission lineboards together are outlined. An approach for bonding Teflon-fiberglass board material is described and evaluated. Bonding of multilayer and multideck stripline sandwiches is discussed. Principal areas which need to be examined in the future are outlined. (Author-PL)

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1970
Accession Number
AD0871408

Entities

People

  • Charles B. May

Organizations

  • Naval Air Weapons Station China Lake

Tags

DTIC Thesaurus Topics

  • Fiberglass
  • Fibers
  • Glass Fibers
  • Inorganic Materials
  • Materials
  • Strip Transmission Lines

Readers

  • Microwave Engineering.
  • Reinforced Composite Materials
  • Systems Analysis and Design