Guidelines for Transfer Molding Electronic Modules.
Abstract
Transfer molding techniques were investigated to develop a Guidelines Document applicable to the production of complex electronic modules. This investigation consisted of both a thorough review of the literature and an extensive test program. The overall investigation important areas of stresses in the important areas of stresses in transfer molded modules, design criteria for transfer molded modules, effects of the transfer molding process on components, material and process parameters of transfer molding, and studies on mold design, equipment and layout. The recommendations and guidelines resulting from the program are given in the Guidelines Document, and the detailed data and information from the program are given in separate Data Volume. Epoxy, FRP-epoxy, mineral filled-epoxy, diallyl phtpalate and silicone were the materials which comprised the electonic modulus. (Author, modified-PL)
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 01, 1970
- Accession Number
- AD0871917
Entities
People
- Charles A. Harper
- Charles D. Larson
- Charles W. Wyble
- George M. Digiacomo
- H. Gray Carter