Rapid Heating and Loading of 7075 - T6 Aluminum Alloy Sheet

Abstract

The purpose of the report is to make available to the design engineer tensile property data on 7075-T6 aluminum, in the longitudinal and transverse directions, under conditions of rapid heating and loading. The tensile property data reported are: ultimate tensile stress, ultimate yield stress (at 0.2- percent offset), elastic modulus, percent total elongation, and percent uniform elongation. These tensile properties were determined at strain rates of 0.0047, 0.0201, and 0.0266 in./in./sec and at temperatures from room temperature (78F) to 700F at 100 degree intervals, excluding 100 and 200F. The time required to reach test temperature was, in most cases, less than 10 seconds. Primary consideration is given to ultimate tensile and yield properties. Other tensile property data reported are secondary and should be used for design criteria only after consideration has been given to the methods used for obtaining and reducing these data. The strength properties of the test material increased with an increase in strain rate from 300 to 700F with one exception at 500F on the transverse specimens. However, from room temperature to 300F, the strength properties showed almost no change with respect to strain rate except for a point at room temperature on the longitudinal specimens.

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Document Details

Document Type
Technical Report
Publication Date
May 28, 1970
Accession Number
AD0875636

Entities

People

  • John H. Honeycutt

Organizations

  • United States Army Aviation and Missile Command

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Aluminum
  • Aluminum Alloys
  • Load Cells
  • Materials
  • Measurement
  • Mechanics
  • Modulus Of Elasticity
  • Oscilloscopes
  • Plastic Explosives
  • Strain Gages
  • Strain Rate
  • Stress Strain Relations
  • Temperature Gradients
  • Tensile Properties
  • Tensile Stress
  • Test Equipment
  • Yield Strength

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Thermal Physics or Thermal Science.