UHF Film Integrated Circuits.

Abstract

Microwave integrated circuits (MICs) have been under wide investigation and are presently being applied in all segments of the microwave and semiconductor industry. One goal of this investigation was to determine the role of lumped-element circuits as opposed to distributed circuits in the development of MIC technology. Of particular interest were (1) the frequency limitations and (2) power limitations. An additional goal was to investigate the use of MICs at the millimeter-wave frequencies. Studies of novel transmission lines and monolithic GaAs technology for high-frequency MICs were therefore initiated. This report reviews materials and technology for MICs and lumped elements, and describes measurement techniques developed for evaluation of elements, circuits, and materials. Many circuits, both passive and active, were constructed and evaluated. Both lumped and distributed circuits were tested on alumina, sapphire, and GaAs, making use of the technology developed. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1970
Accession Number
AD0876090

Entities

People

  • Bernard Hershenov
  • John J. Hughes
  • Louis S. Napoli
  • Martin Caulton
  • Robert E. Debrecht

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Absorbers (Materials)
  • Advanced Materials
  • Circuits
  • Electronics Industry
  • Engineered Materials
  • Frequency
  • Integrated Circuits
  • Materials
  • Metal Oxide Semiconductors
  • Microwave Integrated Circuits
  • Microwaves
  • Millimeter Waves
  • Semiconductors
  • Transmission Lines

Readers

  • Microwave Engineering.
  • Systems Analysis and Design

Technology Areas

  • 5G
  • Microelectronics