Beam Lead Reliability.
Abstract
A study of the performance of over 16,000 Beam Lead Bonds, used to connect semiconductor devices to external circuitry, was completed. The performance of this now relatively wide-spread connection technique, after exposure to severe mechanical and thermal environments, is shown to be very reliable, with occumulated failures affecting practical device performance of less than 0.58%. Even these failures could probably have been eliminated if a screening similar to the conventional semiconductor 'Burn-in' test could have been incorporated. The causes and natures of failures observed are discussed. The mechanical strength of a large sample of bonds is also investigated. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1970
- Accession Number
- AD0877310
Entities
People
- Thomas W. Fitzgerald