Thermal Power Dissipation of Solid State Electric Power Controllers.

Abstract

A brief study was performed in thermal parameters associated with solid-state load controllers. It was found impractical, with the present state of the art, to realize miniaturization in enclosures for power transistors. Exposed areas, component interface, and bulk thermal resistance are the present limiters in configuration for conventional heat dissipation methods. It is recommended that the power controller specification, MIL-P-81653, be revised to include the thermal design requirements of MIL-T-23103. It is further recommended that special emphasis be placed on developing new materials and techniques to obtain more effective removal of thermal energy for applications of this type. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 30, 1970
Accession Number
AD0879344

Entities

People

  • Cynthia Sears
  • H. Brown

Organizations

  • Naval Air Warfare Center Warminster

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Dissipation
  • Electric Power
  • Heat Resistant Materials
  • Materials
  • Miniaturization
  • Power
  • Resistance
  • Specifications
  • Thermal Resistance
  • Transistors

Fields of Study

  • Physics

Readers

  • Electrical Engineering
  • Systems Analysis and Design
  • Thermal Physics or Thermal Science.