Hydrolytic Stability of Potting Compounds for Electrical Connectors

Abstract

An extensive evaluation of elastomeric potting compounds for their ability to withstand long term exposure to high temperature and humidities is described. This work was initiated as a result of the reversion of potting compounds in the electrical connectors on the F-4 in which the compounds softened and liquefied. Materials tested included polyurethanes, epoxies, silicones and polysulfides. Coatings and tubing were tested in addition to the potting compounds. This effort involved the establishment of more severe humidity-temperature tests than were previously used in military specifications. The results of testing many specification and non-specification compounds to the more severe conditions are included.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1970
Accession Number
AD0880151

Entities

People

  • Philip A. House

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Air Platforms
  • Human Systems
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Aircrafts
  • Biomedical And Dental Materials
  • Electronic Equipment
  • Government (Foreign)
  • Governments
  • High Humidity
  • High Temperature
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Materials Science
  • Materials Testing
  • Metal Matrix Composites
  • Plastic Explosives
  • Printed Circuits
  • Test And Evaluation

Readers

  • Polymer Science and Engineering.
  • Software Engineering