Production Engineering Measure for Solid Encapsulated Semiconductor Devices.
Abstract
Over six hundred parts have been tested for a pressure cooker test and a temperature cycle test. Over fifty percent of the tested parts failed the pressure cooker screening test. Fourteen percent of the tested parts failed the temperature cycle test. Aluminaborosilicate passivated transistors molded with epoxy resin, parylene passivated transistors molded with silicone resin, and GE602 RTV passivated transistors molded with silicone are investigated. A review of experimental data on the junction coating materials and molding materials are presented. (P.S.-PL)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1970
- Accession Number
- AD0881232
Entities
People
- Gary Smolker