Conductive, Lusterless Coatings for Light Metals.
Abstract
Development of a process for electrodepositing lusterless, conductive coating on light metals was continued with the objectives of (1) eliminating zinc and copper undercoats and improving corrosion resistance, and (2) identifying satisfactory ranges of operating conditions and solution composition for electroplating lusterless nickel. By conditioning aluminum anodically in sodium carbonate solution, adherent nickel was deposited directly, which eliminated the conventional zinc and copper undercoats. Investigation of analogous procedures for plating nickel on magnesium was initiated. Ranges were established for the current density and temperature of the lusterless nickel plating bath and the appropriate concentration of activated carbon to produce a low gloss index (<3) and to minimize the color contrast between abraded and unabraded areas. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1971
- Accession Number
- AD0881420
Entities
People
- Carl H. Layer
- Glenn R. Schaer
- John Mccallum
- William E. Howe
- William H. Safranek
Organizations
- Battelle Memorial Institute