Product Engineering Measure, Solid Encapsulated Semiconductor Devices.
Abstract
The objective of this production engineering measure is to develop theproduction capacity to produce small signal plastic transistors capable ofqualifying for military application. The passivation techniques used duringchip fabrication and the assembly scheme used to encapsulate the chips areinvestigated. The performance of present commercial chips in siliconeencapsulant utilizing SiO2 passivation are listed in detail. The comparisonbetween Si3N4 and SiO2 passivation is included. The effects of assemblyclean procedures versus a wafer clean or steam getter procedure are investigated.High purity, solventless silicone resins are evaluated for use in semiconductorjunction coating. Typical properties of these resins in the cured state aregiven. (S.M.-PL)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1970
- Accession Number
- AD0881446
Entities
People
- Robert E. Christensen
- Robert J. Karasch
Organizations
- Motorola Mobility