The Development of High Temperature Stable Polyimide Structural Adhesives
Abstract
A new polyimide resin, AF-R-2009, which had exhibited an oxidative stability superior to that of commercially available polyimides under isothermal aging at 700 F was formulated into a series of adhesives. The respective adhesives were used to bond Ti- 8A1-1V-1Mo titanium and 17-7 PH stainless steel alloy adherends. Tensile lap shear strength properties were determined at room temperature and at 600 and 700 F after isothermal aging at the respective temperatures. One formulation of the AF-A- 2009 adhesive was essentially equivalent to commercially available polyimide adhesives at 600 F exposure with both titanium and stainless steel adherends. The effects of varying the concentration of antioxidant, arsenic thioarsenate, on bonded joint strengths were determined. The need for improved surface treatments for titanium adherends was substantiated by the bonded joint strength data obtained with the experimental adhesive. The infrared spectra of the respective formulations were obtained to study the B-staging and cure processes and to determine the effect of additives on the respective IR spectra. (Author-PL)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1971
- Accession Number
- AD0887136
Entities
People
- E. A. Arvay
- T. J. Aponyi
Organizations
- Air Force Research Laboratory