Production Engineering Measure Solid Encapsulated Semiconductor Devices.

Abstract

The objective of this report is to develop the production capacity to produce small signal plastic transistors capable of qualifying for military applications. A COMPARISON OF TWO TYPES OF WAFER PASSIVATION IS DISCUSSED. A comparison of two methods of device surface cleaning is also reported. Various assembly methods are described. (P.S.-PL)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1972
Accession Number
AD0892496

Entities

People

  • James C. Wright
  • Leroy C. Donnally

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Compound Semiconductors
  • Electronic Equipment
  • Electronics
  • Engineering
  • Manufacturing
  • Mass Production
  • Military Applications
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Semiconductor Devices
  • Semiconductors
  • Transistors

Fields of Study

  • Engineering
  • Materials science

Readers

  • Semiconductor Device Technology
  • Software Engineering

Technology Areas

  • Microelectronics