Microcircuit Bond Screening Study.

Abstract

A study was undertaken to determine if any standard or nonstandard environment would provide an effective screen to remove weak bonds from integrated circuits. Both flat packages and dual-in-line packages were considered. All of the devices utilized .001 in. dia. aluminum wire, ultrasonically bonded to chip and post. The results indicated that package disintegration precedes bond detachment, even when bonds are only lightly attached. It is concluded, based on the results obtained from this study, that none of the environments used provided a totally effective screen for weak ultrasonic bonds.

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1971
Accession Number
AD0892498

Entities

People

  • Bennie Bonomi
  • John Gaffney

Organizations

  • RTX

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Circuits
  • Disintegration
  • Electronics
  • Environment
  • Integrated Circuits
  • Microcircuits
  • Networks
  • Standards

Readers

  • Electrochemical Engineering/ Fuel Cell Technologies
  • Integrated Circuit Design and Technology.
  • Maritime Combat Support and Expeditionary Logistics.

Technology Areas

  • Microelectronics