Reliability Evaluation of Radiation Hardened Quad NAND Gates.

Abstract

Radiation hardened integrated circuits of the Quad NAND Gate type were evaluated using both standard high temperature stress tests and specially designed low temperature tests. As a result of this program, effective methods were devised for accelerating the major failure mechanism, i.e., electrochemical attack of thin film nichrome resistors. The basic chemical and structural factors contributing to this mechanism were investigated using electron beam microanalysis techniques. Based upon the results of these studies, methods are proposed for minimizing the effects of this failure mechanism for this class of circuits. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1972
Accession Number
AD0893617

Entities

People

  • John J. Bart
  • Vincent C. Kapfer

Organizations

  • Rome Laboratory

Tags

DTIC Thesaurus Topics

  • Circuits
  • Corpuscular Radiation
  • Electron Beams
  • Failure Mode And Effect Analysis
  • High Temperature
  • Integrated Circuits
  • Low Temperature
  • Nand Gates
  • Radiation
  • Stress Tests
  • Test And Evaluation
  • Thin Films

Readers

  • Applied Combinatorial Optimization and Logic Circuit Design.
  • Software Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Microelectromechanical Systems