Production Engineering Measure for an Electron-Beam Machine and Microwave Transistors.

Abstract

Significant steps were made toward establishing a fully computer-controlled electron-beam delineation capability for fabrication of microwave transistors. The first lot of slices (EBT-1) was processed through all the microwave transistor 'masking' levels to establish electron resist and etching processes. Significant problems were not encountered using PMMA RESIST UNTIL THE CONTACT 'MASKING' LEVEL. A CHANGE IN THE ETCH RATE OF THE SPUTTERED GOLD DUE TO ELECTRON-BEAM IRRADIATION CAUSED SEVERE UNDERCUTTING OF THE EMITTER FINGERS USING PMMA and conventional chemical etching techniques. A negative electron resist polystyrene was utilized on Lot EBT-5 to take advantage of this etch rate differential. Polystyrene enabled delineation of 0.7 m emitter contact fingers on all slices in this lot. Evaluation of the transistors from Lot EBT-5 is in progress. Excellent progress was made this quarter toward fully automating pattern registration for fabrication of 6 GHz transistors. Lots EBT-4 and EBT-5 were used to test the alignment capability of the automatic pattern registration (APR) system on wafers going through the 6 GHz transistor process. Another major step toward fully computer- controlled e-beam delineation was accomplished through assembly and check-out of the electrical and mechanical hardware necessary for the step-and-repeat operation. (Author, modified-PL)

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1972
Accession Number
AD0900280

Entities

People

  • Daniel Ch'en
  • Gilbert L. Varnell
  • Roger R. Webster

Organizations

  • Texas Instruments

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Chemical Etching
  • Computers
  • Dielectric Polymers
  • Electron Beams
  • Electrons
  • Engineering
  • Etching
  • Fabrication
  • Manufacturing
  • Microwaves
  • Polystyrenes
  • Production
  • Production Engineering
  • Transistors

Readers

  • Semiconductor Device Technology
  • Surface Coatings Technology.
  • Systems Analysis and Design

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems