Application of Cold Plates to Electronic Equipment Cooling.
Abstract
Analytical and experimental work have been performed to investigate the feasibility for heat pipe technology for electronic equipment thermal control. Temperature level and uniformity, amplitude and the frequency of thermal cycling have significant adverse effect upon the reliability and operational characteristics of electronic equipment. In order to promote heat transfer and improve the temperature distribution, the electronic equipment cooling plates (cold plates) were provided with integral heat pipes. The experimental cold plates which were tested can be divided into three general categories. (1) conventional fin-tube configurations, (2) fin-tube configuration provided with temperature control capabilities (constant temperature or variable conductance cold plate), and (3) flat, continuous cavity configuration. Actual and simulated electronic components were attached to the plates and used as heat loads.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1972
- Accession Number
- AD0906907
Entities
People
- Carl J. Feldmanis
Organizations
- Flight Dynamics Laboratory