Reliability of Linear Integrated Circuits in Ceramic and Plastic Packages
Abstract
This final report describes the results obtained on a study of the reliability of linear integrated circuits. The objective of the contract was to investigate and determine the basic failure mechanisms associated with linear microcircuits fabricated in ceramic and plastic packages. The type of test vehicle chosen for this program was the 741 operational amplifier. Two of the five vehicles chosen for the program were manufactured by one supplier with half of the devices encapsulated in ceramic packages and the other half encapsulated in silicone plastic. The devices fabricated by the other supplier included three packaging variations: the first was a ceramic package with conventional metallization and wire bonding, the second was a plastic encapsulated package with conventional metallization and wire bonding, and the third was a plastic encapsulated package utilizing a gang bonding technique. In addition, Test Element Groups (TEGs) were fabricated using the last three packaging techniques. The test plan for these devices was designed to include both step-stress and long-term stress-in-time tests. The stresses were chosen to identify any failure mechanisms that could be activated by high temperature, temperature cycling, salt atmosphere, steam pressure and high humidity environments.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1972
- Accession Number
- AD0907445
Entities
People
- Albert Fox
- Alfred Poe
- Byron L. Bair
- Erwin A. Herr
Organizations
- General Electric