Complementary Broadband Power Amplifier, 225 to 400 Megahertz.
Abstract
Twelve UHF high-power-amplifier modules were developed, utilizing thin-film hybrid integrated circuit technology and a modular building approach. Several functional, integrated, power-amplifier stages were cascaded and paralleled, utilizing 3-dB quadrature couplers to achieve the high power gain and output power. The power amplifiers were designed to operate over the 225- to 400-megahertz frequency range and provide a power output of 40 t0 50 watts of (CW) power. Each functional, integrated, power-amplifier stage utilized thin-film inductors, capacitors, resistors and transistor pellets mounted on a single 350-mil-square BeO substrate. These components were ultrasonically wire-bonded together forming a hybrid integrated circuit. The power amplifier stages were designed for direct insertion into a 50-ohm transmission line. The UHF power amplifier modules were designed specifically for amplitude-modulation systems where 40 to 50 watts fo peak power are required (10-watt carrier level). (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1972
- Accession Number
- AD0907497
Entities
People
- Robert Minton