Development of an Electrochemical Machining Process for Rifling Lined Gun Barrels

Abstract

A 16-month program was conducted to advance high performance gun barrel technology by developing an electrochemical machining process for rifling high performance barrel liner materials. A total of 15 electrolytes and numerous electrochemical machining parameters were evaluated in conducting electrochemical machinability studies on iron-nickel-base, nickel-base, and cobalt-base superalloys, and on refractory alloys of columbium, molybdenum, tantalum, and tungsten. Four materials (L-605, VM-103, CG-27, and alloy 718) were selected for electrochemical rifling and fabrication into caliber .220- Swift barrel liners. The rifled liners were insulated externally and assembled into outer barrel jackets using a drawing process, thus producing insulated composite test barrels. A total of 12 test barrels compatible with an MG-3 machine gun, representing the four liner materials and three jacket materials (H-11, A-286, and Pyromet X-15), were fabricated and delivered to the Air Force. The results of this program indicated that electrochemical machining is a feasible process for obtaining high quality and low cost rifling, and that extrapolation of this process to larger calibers appears feasible.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1972
Accession Number
AD0909379

Entities

People

  • David L. Corn
  • Richard A. Harlow
  • Richard C. Kimball

Tags

Communities of Interest

  • C4I
  • Ground and Sea Platforms
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Assembly
  • Composite Materials
  • Contracts
  • Erosion Resistance
  • Fabrication
  • Gun Barrels
  • High Temperature
  • Machine Guns
  • Machining
  • Manufacturing
  • Materials Processing
  • Refractory Metals
  • Sodium Compounds
  • Sodium Hydroxide
  • Test And Evaluation

Readers

  • Manufacturing Engineering.
  • Materials Science and Engineering.
  • ballistics.

Technology Areas

  • Microelectronics