Multilayer Interconnections for Hybrid Microcircuits.
Abstract
This program covered an investigation of the failure modes and mechanisms for two types of ceramic multilayer substrates mounted within a hermetic package; and the development of suitable tests which were modified and are submitted as recommendations for the evaluation and/or qualification testing of high reliability substrates. The technical guidelines for the contract specify the two types of test substrates as follows: (1) Thick Film Multilayer Conductor System composed of successive layers of screened conductors and dielectrics, and (2) Homogeneous Metal-Ceramic Multilayer System composed of individual layers of green ceramic, each layer having a conductor pattern. These layers are stacked and fired simultaneously to form a monolithic metal-ceramic multilayer structure.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 1974
- Accession Number
- AD0918501
Entities
People
- John R. Moore
Organizations
- Sylvania Electric Products