Multilayer Interconnect Technology Investigation.

Abstract

This program shows that the all aluminum metalization system using the mushroom and EBM (Expendable Bimetal Mask) techniques is a viable method of applying multilayer metalization to full wafer bipolar and MOS LSI. This report also shows that this multilayer system is compatible with thin film resistor, refractory metal and beam lead technologies. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1974
Accession Number
AD0922099

Entities

People

  • G. Wolfe Jr.
  • K. C. Hu
  • W. A. Mcdowell

Organizations

  • Hughes Aircraft Company

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Beam Lead Technology
  • Beam Leads
  • Electronic Components
  • Electronic Equipment
  • Expendable
  • Film Resistors
  • Films
  • Fixed Resistors
  • Fungi
  • Metals
  • Refractory Metals
  • Resistors
  • Thin Film Resistors
  • Thin Films

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Metallurgy
  • Nanofabrication and Microfabrication.