Advanced Research in Optical Refrigeration and Applications (ARORA)
Abstract
A significant improvement in thermal properties is measured for the sapphire thermal link, compared to the fused silica link. When measured quantitatively, it can be seen that no thermal barrier exists for the Van Der Waals bonded sapphire link, while adhesive imposes significant impedance. Additionally, no thermal gradient exists along the length of the sapphire link, thanks to the high thermal conductivity, whereas the fused silica link exhibits a significant gradient.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 18, 2014
- Accession Number
- AD1006937
Entities
People
- Mansoor Sheik-bahae
Organizations
- University of New Mexico