MEMS-Electronic-Photonic Heterogeneous Integrated FMCW Ladar Source

Abstract

The goal of this project is to develop a modular, heterogeneous integration process to combine III-V tunable VCSELs, silicon photonic integrated circuits, and CMOS ICs in a seamless manner, and demonstrate a single-chip FMCW (Frequency-Modulated Continuous-Wave) LADAR source. In Phase 2, we have successfully developed through-silicon-vias (TSVs) on Si photonics at wafer level, and stacking the Si photonic dies on top of CMOS at die level. Electrical and mechanical properties of the bonded systems were characterized. FPGA and CMOS programming using a custom graphical user interface have been implemented, and optical and electrical interfacing to the system has been achieved.

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Document Details

Document Type
Technical Report
Publication Date
Dec 18, 2015
Accession Number
AD1007690

Entities

People

  • Bernhard E. Boser
  • Constance Chang-hasnain
  • Eli Yablonovitch
  • Ming C. Wu

Tags

DTIC Thesaurus Topics

  • Accuracy
  • Beat Signals
  • Detectors
  • Electronic Circuits
  • Electronics
  • Failure Mode And Effect Analysis
  • Frequency
  • Integrated Systems
  • Materials
  • Measurement
  • Mechanical Properties
  • Range Finding
  • Semiconductors
  • Shear Tests
  • Three Dimensional
  • Voltage Controlled Oscillators
  • Waveform Generators

Fields of Study

  • Physics

Readers

  • Acoustical Oceanography.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems