Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Workflow Protocols

Abstract

An adhesively bonded single lap joint was used to study the effects of coupon thickness, bondline thickness, surface preparation, presence of an overflow fillet, and adhesive type. Gains in the Education of Mathematics and Science high school and middle school students prepared 960 single-lap-joint samples with US Army Research Laboratory (ARL) technicians fabricating an additional 245 controls. Workflow protocol was orchestrated using ARLs Materials Selection and Analysis Tool relational database. Moreover, the enhanced pedigree and integrity enabled by centering workflow on a robust relational database allow for supplemental release of all raw and analyzed experimental data, along with associated metadata, in downloadable format that is included with this report.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 2016
Accession Number
AD1010223

Entities

People

  • Daniel C. Deschepper
  • David P. Flanagan
  • Robert E. Jensen

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Engineered Resilient Systems

DTIC Thesaurus Topics

  • Adhesives
  • Data Science
  • Databases
  • Digital Data
  • Education
  • Failure Mode And Effect Analysis
  • Information Science
  • Materials
  • Mathematics
  • Military Research
  • Multivariate Analysis
  • Relational Databases
  • Spreadsheet Software
  • Statistical Analysis
  • Statistics
  • Students
  • Three Dimensional

Readers

  • Database Systems and Applications
  • Distributed Systems and Data Platform Development
  • Surface Coatings Technology.