Characterization of Magnetron Sputtered Copper-Nickel Thin Film and Alloys

Abstract

Copper (Cu)-nickel (Ni) thin films are prepared by magnetron sputtering using an AJA International model ATC-2200 system. The as-deposited films are in the amorphous state during room temperature deposition but transition to a crystalline state at an elevated substrate temperature beyond 250 deg C. The crystalline films have a mixed (111)- and (200)-oriented texture that becomes predominantly (111)-orientated after an annealing treatment. Bilayer CuNi deposited films with ratio of 12:1, 6:1, 4:1, and 3:1 produced final alloy concentrations of 90/10, 83/17, 76/24, and 70/30 atomic %, respectively, after annealing, and their average surface roughness increased with higher Cu concentration. These results show that the final thin film alloy composition can be effectively controlled by varying the ratio of the initial deposited Cu and Ni layers. The morphology of these films were studied by atomic force microscope (AFM), X-ray Diffraction (XRD), electrical 4-point probe, and energy-dispersive X-ray spectroscopy (EDX).

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 2016
Accession Number
AD1017374

Entities

People

  • Andrew A. Chen
  • Eugene S. Zakar
  • James Mulcahy
  • Nicholas A. Strnad
  • Robert A. Burke
  • Samuel G. Hirsch

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Annealing
  • Chemical Vapor Deposition
  • Composite Materials
  • Diffraction
  • Films
  • Magnetrons
  • Materials
  • Military Research
  • Radiation
  • Roughness
  • Spectroscopy
  • Sputtering
  • Substrates
  • Surface Roughness
  • Thin Films
  • X Rays
  • X-Ray Diffraction

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Thin Film Deposition Science.