Self Diagnostic Adhesive for Bonded Joints in Aircraft Structures

Abstract

Bondline integrity is one of the most critical concerns in the design and operation of aircraft and spacecraft structures up to date. Nevertheless, current state-of-the-art non-destructive evaluation (NDE) and structural health monitoring (SHM) techniques are incapable of offering mature solutions regarding bondline integrity monitoring. Therefore, the objective of the proposed research is the development of a complete approach for integrity monitoring and self-diagnosis of adhesively bonded structures. During the reporting period, three major accomplishments were achieved:1) Screen-printed piezo-electric sensors of the new design were developed and fabricated. The new sensors had a smaller dimension compared to the previous design to minimize the parasitic effect when embedded into bondlines. 2) The developed impedance-based diagnostic algorithms were validated under the fatigue/dynamic loading condition. 3) Both SEM (Spectral Element Modeling) and FEM (Finite Element Modeling) simulation of the impedance of the embedded piezo-electric sensor was conducted.

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Document Details

Document Type
Technical Report
Publication Date
Oct 04, 2016
Accession Number
AD1021518

Entities

People

  • Fu-Kuo Chang

Organizations

  • Stanford University

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Biomedical
  • Sensors

DTIC Thesaurus Topics

  • Actuators
  • Advanced Materials
  • Air Force Research Laboratories
  • Algorithms
  • Ceramic Materials
  • Composite Materials
  • Composite Structures
  • Detectors
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Piezoceramics
  • Piezoelectric Materials
  • Signal Processing
  • Structural Health Monitoring

Readers

  • Integrated Circuit Design and Technology.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Space