Moving Beyond 3D Hetero-Integration and Towards Monolithic Integration of Phase-Change RF Switches with SiGe BiCMOS

Abstract

A chip-scale, highly-reconfigurable transmitter and receiver, which hetero-integrates Northrop Grummans novel phase-change switch (PCS) technology with commercial SiGe BiCMOS using 3D stacking has been demonstrated. Further miniaturization and performance improvements are being pursued through fully monolithic integration. The current state of the technology will be discussed followed by a discussion of the advantages, goals and challenges of fully monolithic integration.

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Document Details

Document Type
Technical Report
Publication Date
Mar 31, 2016
Accession Number
AD1025053

Entities

People

  • Doyle Nichols
  • Nabil El-Hinnawy
  • Pavel Borodulin
  • Robert M. Young

Organizations

  • Northrop Grumman

Tags

DTIC Thesaurus Topics

  • Amplifiers
  • Aspect Ratio
  • Assembly
  • Boundaries
  • Circuits
  • Conductivity
  • Converters
  • Department Of Defense
  • Flip Chips
  • Governments
  • Logic
  • Logic Gates
  • Miniaturization
  • Structural Integrity
  • Thermal Conductivity
  • Thickness
  • Transmission Lines

Readers

  • Integrated Circuit Design and Technology.
  • Naval Engineering and Maritime Security