Thermally Optimized Paradigm of Thermal Management (TOP-M)
Abstract
The main goal of this research was to present a New Thermal Management Approach, which combines thermally aware Very/Ultra Large Scale Integration (VLSI/ULSI) architecture design with liquid cooling design from the very early step of the demonstrator System on Chip (SoC) design. Thermal sensors, which were integrated on several parts of the SoC, measured the on-line the local temperature, thus enabling better operation of the SoC as well as better control over the liquid cooling by providing on-line feedback. Complementary Metal Oxide Semiconductor (CMOS) Single Photon Avalanche Diode (SPAD) image sensors were used to demonstrate the new thermal management approach.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 18, 2017
- Accession Number
- AD1038321
Entities
People
- Maria Malitis
- Ran Ginosar
- Yael Nemirovsky