Synthesis of Bilayer Graphene on 90/10 Copper (Cu)/Nickel (Ni) Alloy and Transfer by Electrochemical Delamination

Abstract

This study reports the growth of bilayer graphene on 90/10 copper/nickel alloy foils and thin films by chemical vapor deposition. We also describe an electrochemical delamination method that does not rely on etching of the underlying metal for release of the graphene layer. Instead, hydrogen bubble evolution is used to separate the graphene at the metal/graphene interface. The bubble delamination process overcomes difficulties associated with traditional wet etching of the metal, allowing major reductions in processing time and generation of hazardous chemical waste. Furthermore, since the metal catalyst is not consumed in the process, it can be recycled. The graphene can be transferred to a rigid or flexible substrate. We evaluate the quality of graphene transferred from a metal foil and metal film to a host silicon dioxide/silicon substrate by micro Raman and optical microscopy imaging methods.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 2017
Accession Number
AD1041268

Entities

People

  • Eugene S. Zakar
  • Madan Dubey
  • Robert A. Burke

Organizations

  • United States Army Research Laboratory

Tags

DTIC Thesaurus Topics

  • Chemical Synthesis
  • Chemical Vapor Deposition
  • Chemistry
  • Delamination
  • Field Effect Transistors
  • Films
  • Hydrogen
  • Materials
  • Metal Films
  • Metals
  • Raman Spectra
  • Raman Spectroscopy
  • Silicon Dioxide
  • Substrates
  • Surface Roughness
  • Thin Films
  • Vapor Deposition

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Nanofabrication and Microfabrication.
  • Nanoscale Plasmonic Nanotechnology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene