Thermal Simulation of a Diode Module Cooled with Forced Convection
Abstract
We have performed a thermal simulation of an electronic module cooled by forced convection and compared the simulation to the results of a laboratory test of the module. We modeled the modules geometry and materials, and used the operating conditions of the laboratory experiment as inputs for the simulation. We found close agreement between the steady-state temperatures calculated in our model and the temperatures observed in the laboratory, validating our simulation methods.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 2011
- Accession Number
- AD1043593
Entities
People
- Gregory K. Ovrebo
Organizations
- United States Army Research Laboratory