Electrodeposition of Metal Matrix Composites and Materials Characterization for Thin-Film Solar Cells

Abstract

We have demonstrated that metal matrix composites, which consist of silver-multi-walled carbon nanotube-silver, layer-by-layer stack, can electrically bridge the cracks (>40 m) that appear in the semiconductor substrates and the composite grid lines. This gap bridging was proven to be repeatable through strained-to-failure/closed-gap repeat cycles. For device demonstration, the composites were integrated onto commercial triple-junction cells, and the composite-enhanced cells showed strong crack-tolerance, maintaining >95% of the short circuit current upon substrate fracture. By contrast, the conventional metallization led to >50%loss in short circuit current. The composite metallization was also superior in minimizing the overall efficiency loss against fracture, compared to the conventional metallization. During the project extension period, we have initiated composite materials modeling and circuit modeling to establish microstructure-mechanical/electrical property relationship.

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Document Details

Document Type
Technical Report
Publication Date
Dec 04, 2017
Accession Number
AD1045887

Entities

People

  • Sang M Han

Organizations

  • University of New Mexico

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Carbon Nanotube Composites
  • Carbon Nanotubes
  • Composite Materials
  • Electrical Properties
  • Electrodeposition
  • Electroplating
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Properties
  • Metal Matrix Composites
  • Modulus Of Elasticity
  • Solar Cells
  • Spacecraft

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Reinforced Composite Materials
  • Solar Photovoltaics and Thermoelectric Devices.

Technology Areas

  • Microelectronics