Heterogeneous Multi-Die High-Density Interconnect Stitching

Abstract

A high-density and a highly scalable heterogeneous multi-die integration technology is presented in this paper. Central to this approach is the dense integration ofheterogeneous ICs enabled by fine-pitch Compressible MicroInterconnects (CMIs) and stitch chips, which serve as the interface through which communication between active ICs occurs. A testbed is fabricated in order to characterize and demonstrate the proposed integration technology: concatenated assembly of chips using the stitch chips with fine-pitch CMIs (inline pitch of 20 microns). Electrical characterization, including resistance and S-parameters, of the interconnects are reported as well as the assembly of testbeds. The measured results show robust and low-loss interconnections across multi-chips

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Document Details

Document Type
Technical Report
Publication Date
Mar 12, 2018
Accession Number
AD1052611

Entities

People

  • Joe L. Gonzalez
  • Muhannad S. Bakir
  • Paul K. Jo
  • Xuchen Zhang

Organizations

  • Georgia Tech

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Artificial Intelligence
  • Assembly
  • Big Data
  • Cloud Computing
  • Computers
  • Computing System Architectures
  • Fabrication
  • Flip Chips
  • High Density
  • Images
  • Internet Of Things
  • Measurement
  • Resistance
  • Substrates
  • Thickness
  • Transmission Lines
  • Yield Strength

Readers

  • Integrated Circuit Design and Technology.