Polaritonic hot electron infrared photodetector (PHIP) at the wafer scale

Abstract

Third Floor Materials, Inc. (3FM) addressed the need for low-cost, high throughput sensor fabrication with a revolutionary new material technology that plasmonically couples infrared light into an electrical signal. Over the course of a one-year program, 3FM demonstrated the fundamental science behind and explored the performance envelope of a new sensor utilizing plasmonic coupling in donor-doped cadmium oxide (CdO). The Photoemissive Heterostructure Infrared Photodetector (PHIP) concept overcomes challenges associated with traditional Schottky barrier detectors and shows promise as a potential high-operating temperature sensor.

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Document Details

Document Type
Technical Report
Publication Date
Sep 04, 2018
Accession Number
AD1059241

Entities

People

  • Christopher T. Shelton
  • Jon-Paul Maria
  • Sanjay Krishna

Organizations

  • North Carolina State University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Complementary Metal-Oxide Semiconductors
  • Detection
  • Detectors
  • Electron Mobility
  • Electronics Industry
  • Electronics Laboratories
  • Electrons
  • Energy Bands
  • Infrared Detectors
  • Materials
  • Modules (Electronics)
  • Optical Properties
  • Power Electronics
  • Quantum Efficiency
  • Semiconductors
  • Surface Plasmon Polaritons

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Nanoscale Plasmonic Nanotechnology

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems