RT 186: Product Assurance for Electronics in Harsh Environments

Abstract

Study effect of thermal cyclic loading (AEC-Q100 standard for grade-0package) on the reliability of Cu wirebond QFN packages molded with automotive grade green epoxy mold compounds (EMC). Develop model for finite element analysis by extracting data from 3D model generated using X-ray Micro-CT system. Study effect of different properties (E, CTE) of EMCs on the reliability of wirebonded packages using FEA.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 2018
Accession Number
AD1063073

Entities

People

  • Pradeep Lall

Organizations

  • Auburn University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Corrosion
  • Diffusion Coefficient
  • Environment
  • Equations
  • Experimental Data
  • Extreme Environments
  • Galvanic Corrosion
  • Geometry
  • Materials
  • Mechanical Properties
  • Modulus Of Elasticity
  • Reliability
  • Strain Rate
  • Stress Strain Relations
  • Stresses
  • Tensile Strength
  • X Rays

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Polymer Science and Engineering.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems