Reliability of Silver Wire Bonds in Harsh Environments (RT 190)

Abstract

Reliability of different wirebond material candidates subjected to HTSL. Identify modes of failures, reasons of failures and time to failure for each wirebond pair subjected to prolonged exposure at high temperature. IMC phase evolution sequence and cracking phenomenon in wirebonds. Relation between degradation of shear force with change in electric response.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 2018
Accession Number
AD1063076

Entities

People

  • Pradeep Lall

Organizations

  • Auburn University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum Intermetallics
  • Army Aviation
  • Crack Propagation
  • Cracks
  • Electric Contacts
  • Electronic Components
  • Electronics
  • Engineering
  • Environment
  • Extreme Environments
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • High Temperature
  • Intermetallic Compounds
  • Materials
  • Nanomaterials
  • Phase Transformations
  • Reliability
  • Shear Strength
  • Systems Engineering
  • Test And Evaluation
  • Thin Films

Fields of Study

  • Engineering

Readers

  • Auditory Neuroscience/Auditory Physiology.
  • Integrated Circuit Design and Technology.
  • Materials Science (Mechanical Engineering).