Integration of Three-Dimensional Silicon Microtip Arrays onto Flexible Substrate

Abstract

Vertically ordered Si nanotips, due to their nanoscale dimension and low cytoxicity, serve as an ideal platform for minimally invasive penetration into biological cells for the measurement of important electronical and/or mechanical properties at the nanoscale. Currently available Si nanotip arrays are necessarily built on wafer-based substrates due to the requirement of compatibility with existing fabrication processes, leading to nonconformal interface between cells and Si nanotips. Here, we develop a novel fabrication method that enables the heterogeneous integration of vertically ordered Si nanotips with various kinds of mechanically flexible bio-related substrates.

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Document Details

Document Type
Technical Report
Publication Date
Oct 25, 2018
Accession Number
AD1071154

Entities

People

  • Chi H. Lee
  • Dong R. Kim

Organizations

  • Purdue University

Tags

Communities of Interest

  • Biomedical

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Cells
  • Dry Etching
  • Electron Beam Lithography
  • Engineering
  • Etching
  • Fabrication
  • Gene Delivery
  • Images
  • Lithography
  • Manufacturing
  • Materials
  • Mechanical Engineering
  • Printing
  • Systems Biology
  • Three Dimensional

Readers

  • Nanoscale Plasmonic Nanotechnology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene