Wafer Bonding for Hybrid Photonic Integration Research

Abstract

The primary objective of this proposal is to create the wafer bonding capability at Clemson University to support several ongoing photonic integration related projects supported by the DoD. This new capability will also enable many other research projects in photonics and electronics and greatly enhance research-orientated education of undergraduate and graduate students.

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Document Details

Document Type
Technical Report
Publication Date
Apr 22, 2019
Accession Number
AD1082999

Entities

People

  • Zhu Lin

Organizations

  • Clemson University

Tags

DTIC Thesaurus Topics

  • Dielectric Waveguides
  • Distributed Feedback Lasers
  • Electronics
  • Electronics Industry
  • Frequency Combs
  • Hybrid Silicon Lasers
  • Integrated Circuits
  • Laser Diodes
  • Lasers
  • Materials
  • Nonlinear Optics
  • Photonic Devices
  • Photonic Integrated Circuits
  • Quantum Cascade Lasers
  • Semiconductor Lasers
  • Semiconductors
  • Signal Processing

Readers

  • Nanofabrication and Microfabrication.
  • Research Science/Academic Research

Technology Areas

  • Microelectronics