A New Procedure for the Application and Curing of Polyimide Film on Gold Coated Silicon Wafers
Abstract
A new repeatable process was developed for fabricating a polyimide-coated silicon wafer patterned with gold grating lines on the polyimide surface. A silicon wafer was first metalized with gold, followed by a cured polyimide layer, and the resulting polyimide layer was then patterned on the surface with gold grating lines. The project required the polyimide layer to be a uniform thickness across a 2-in silicon wafer. The polyimide coating needed to adhere to the gold undercoating and needed to be patterned with very narrow (on the order of 1.5 microns) repeating gold lines.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 2009
- Accession Number
- AD1090494
Entities
People
- Kimberley A. Olver
Organizations
- United States Army Research Laboratory