3D Integrated Superconducting Qubits
Abstract
As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 09, 2017
- Accession Number
- AD1092355
Entities
People
- Alexander J. Melville
- Andrew J. Kerman
- D. Hover
- D. Rosenberg
- D. Yost
- Daehyun Kim
- F. Yan
- G. O. Samach
- J. L. Yoder
- Livia Racz
- P. Krantz
- Rabindra Das
- S Gustavsson
- S. J. Weber
- W. D. Oliver
Organizations
- MIT Lincoln Laboratory