Calibration and Operation of the Research Devices, Inc., Flip-Chip Hybridization Bonder Model M8-A with Discussion of Solder Materials
Abstract
Precise flip-chip hybrid bonding is achievable using the Research Devices, Inc., Model M8-A Hybridization Bonder after a complete calibration of the equipment is performed. All calibration steps must be completed in sequence prior to any bonding of real parts. Several types of solder material are discussed, and consideration needs to be given to the specific solder material used for a given die and submount pair that will be bonded together.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 22, 2020
- Accession Number
- AD1102544
Entities
People
- Kimberley Olver
Organizations
- United States Army Research Laboratory