2.5D and 3D FPGA-Centric Microfluidic Cooling Architectural Platforms for Superior Computational Throughput

Abstract

During this program, Georgia Tech developed highly integrated microfluidic cooling technologies for 2.5D high-power density and high-performance electronics. Multiple fabrication technologies were developed and demonstrated. Lateral manifolds using 3D printing to enable ultra-compact inlet/outlet manifolds were also developed. Using a Stratix 10 FPGA as a platform, our proposed thermal technologies reduced the junction temperature of the FPGA by more than 32C when compared to air cooling. Moreover when compared to air cooling, the thermal coupling of the FPGA on the surrounding transceiver die temperatures was reduced by a factor of 10x to over 100x.

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Document Details

Document Type
Technical Report
Publication Date
Nov 27, 2019
Accession Number
AD1107009

Entities

People

  • Jon Goldman
  • Muhannad Bakir
  • Yogendra Joshi

Organizations

  • Georgia Tech

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Additive Manufacturing
  • Air Force
  • Air Force Research Laboratories
  • Assembly
  • Computational Fluid Dynamics
  • Couplings
  • Data Centers
  • Digital Signal Processing
  • Electrical Engineering
  • Fabrication
  • Field Programmable Gate Arrays
  • Heat Transfer
  • High Performance Computing
  • Intellectual Property
  • Manufacturing
  • Power Electronics
  • Three Dimensional

Readers

  • Combustion and Flow Dynamics.
  • Military Science and Technology Research and Modernization.
  • Nanofabrication and Microfabrication.

Technology Areas

  • Microelectronics