CMM Level 4 Quantitative Analysis and Defect Prevention with Project Examples
Abstract
The Software Engineering Institutes (SEI) Software (SW) Capability Maturity Model (CMM) Level 4 Quantitative Analysis leads into SW-CMM Level 5 activities. Level 4 Software Quality Management (SQM) Key Process Area (KPA) analysis, which focuses on product quality, feeds the activities required to comply with Defect Prevention (DP) at Level 5.[1] Quantitative Process Management (QPM) at Level 4 focuses on the process which leads to Technology Change Management (TCM) and Process Change Management (PCM) at Level 5. At Level 3,metrics are collected, analyzed and used to status development and to make corrections to development efforts, as necessary. At Level 4, measurements are quantitatively analyzed to control process performance of the project and to develop a quantitative understanding of the quality of products to achieve specific quality goals. This paper presents the application of Statistical Process Control (SPC) in accomplishing the intent of SQM and QPM and applying the results to DP. Real project results are used to demonstrate the use of SPC as applied to software development. The main quantitative tool used was Statistical Process Control utilizing control charts. The project analyzed life cycle data collected during development for requirements, design, coding, integration, and during testing. Defects were collected during these life cycle phases and were quantitatively analyzed using statistical methods. The intent was to use this analysis to support the project in developing and delivering high quality products and at the same time using the information to make improvements, as required, to the development process.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1999
- Accession Number
- AD1108245
Entities
People
- A.l. Florence
Organizations
- MITRE Corporation