Impact of Thermal Effects and Mechanical Stress on the RF Performance of Flexible Transmit and Receive Modules

Abstract

In the project Impact of Thermal Effects and Mechanical Stress on the Microwave Performance of Transmit and Receive Circuits on Flexible Substrates, funded by the Hybrid Integrated Flexible Electronic Systems (HiFES) program at the National University of Singapore, and by AOARD, basic research was undertaken to investigate feasibility of active radio frequency (RF) circuits on flexible substrates, for application in flexible phased array antennas.

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Document Details

Document Type
Technical Report
Publication Date
Oct 22, 2020
Accession Number
AD1113303

Entities

People

  • Koenraad Mouthaan

Organizations

  • National University of Singapore

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Amplifiers
  • Antenna Arrays
  • Antennas
  • Beam Steering
  • Circuit Boards
  • Conformal Antennas
  • Dacron
  • Dielectric Properties
  • Electronics
  • Fabrication
  • Films
  • Low Noise
  • Low Noise Amplifiers
  • Military Research
  • Phased Arrays
  • Radiation Patterns
  • Radio Frequency
  • Thermal Conductivity
  • Three Dimensional
  • Wireless Communications

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Radar Systems Engineering.
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics