Improved Si-Si Waferbonding as a Step Toward Lighter, More Accurate Microelectromechanical System (MEMS) Gyroscopic Sensors

Abstract

A quad-mass gyroscope (QMG) is a microelectromechanical system that can be used to sense rotation by detecting the change in motion of four masses. Our goal is to produce a lighter, more accurate gyroscopic sensor than what is currently available for handheld navigational devices. This research focuses on wafer-level packaging using silicon fusion bonding (SiSi bonding), which will allow us to produce 156 QMGs per run while being cost-effective and time-efficient. One issue with wafer-level packaging is the effect fabrication-process thermal budgets have on device performance. This research investigates the effect of various surface treatments such as RCA cleaning, vapor hydrofluoric acid etching, and Ar/O2 Plasma Cleaning on SiSi bond strength to improve bond quality at low temperatures while preventing damage to the packaged devices.

Document Details

• Document Type: Technical Report
• Publication Date: Mar 01, 2021
• Accession Number: AD1126848

Entities

People

• Henry Gagliardi
• Robert R. Benoit

Organizations

• Oak Ridge Associated Universities
• United States Army Research Laboratory

Tags

Communities of Interest

• Advanced Electronics
• Materials and Manufacturing Processes

DTIC Thesaurus Topics

• Abstracts
• Acids
• Base Pressure
• Chemical Compounds
• Crack Propagation
• Department Of Defense
• Energy
• Fabrication
• Gyroscopes
• High Temperature
• Hydrofluoric Acid
• Hydrophilic Properties
• Hydrophobic Properties
• Information Operations
• Instructions
• Low Temperature
• Microelectromechanical Systems
• Military Research
• Packaging
• Surface Energy
• Surface Finishing
• Surface Tension
• Test Methods
• Universities

Readers

• Inertial Navigation Systems.
• Integrated Circuit Design and Technology.
• Surface Coatings Technology.

Technology Areas

• Microelectronics
• Microelectronics - Graphene
• Microelectronics - Microelectromechanical Systems