Semiconductor Foundry Verification

Abstract

Problem Statement: Chips delivered are not the chips requested (Different layout, process, materials, components, tolerances, etc.); May or may not do everything the original chip does (May or may not do extra, potentially undesirable things as well); Most chips in consumer devices not made in U.S. (Introduces supply chain issues and Subcontractor of subcontractor of subcontractor of ); and Chip markings and packaging often similar/identical (Need deeper analysis).

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 2016
Accession Number
AD1128805

Entities

People

  • Alexander Volynkin

Organizations

  • Carnegie Mellon University

Tags

Communities of Interest

  • Engineered Resilient Systems

DTIC Thesaurus Topics

  • Anomaly Detection
  • Change Detection
  • Contractors
  • Contracts
  • Department Of Defense
  • Detection
  • Dissolving
  • Encapsulation
  • Engineering
  • Fabrication
  • Guarantees
  • Image Processing
  • Integrated Circuits
  • Materials
  • Metals
  • Parallel Computing
  • Parallel Processing
  • Semiconductors
  • Software Development
  • Supply Chain
  • Universities
  • Verification

Readers

  • Industrial Economics
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems