3D Split of Obfuscation, Authentication, and Licensing (3D-SOUL)
Abstract
This report summarizes the 3D Split of Obfuscation, Authentication and Licensing (3D-SOUL) project which developed mechanisms to protect intellectual properties (IPs) that are manufactured in untrusted facilities. It allows entire or parts of IP in an untrusted chip to be obfuscated, while pushing the mechanism for unlocking and secure activation of untrusted chip out to a trusted chip. 3D-SOUL is an obfuscation scheme designed to work with DARPA SPADE architecture, in which an untrusted chip is 3D-stacked on top of a trusted chip, allowing us to benefit from the scalability and speed of untrusted chip, while taking advantage of the security offered by trusted chip. This approach leads to a solution that is using the best features of two chips. A trusted chip is fabricated in a trusted foundry in an older but secure, well protected, and well-understood technology. In this scheme, the trusted chip, encapsulating the sensitive information, verifies the integrity of untrusted chip, performs sensitive logic monitoring, and controls the obfuscation scheme in an untrusted chip. Additional, features developed under this program allows for a light-weight encypted communication channel to be established between the trusted and un-trusted chipsets. This allows an IP to be manufactured in a leading technology, to obtain a faster and more scalable solution, while at the same time alleviating many hardware security concerns.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 2021
- Accession Number
- AD1149026
Entities
People
- Avesta Sasan
- Kris Gaj
Organizations
- George Mason University