Indium Inks and Pastes for High-Resolution, High-Density Printed Electronics

Abstract

The technology presented is nanoparticle dispersions (inks and pastes) of indium sub-micron particles for printing indium circuits and solder joints for next-generation electronics packaging and quantum computing.

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Document Details

Document Type
Technical Report
Publication Date
Sep 15, 2021
Accession Number
AD1151131

Entities

People

  • Richard Fink

Organizations

  • United States Central Command

Tags

Communities of Interest

  • C4I
  • Sensors
  • Weapons Technologies

DTIC Thesaurus Topics

  • Alloys
  • Chemistry
  • Copper Nickel Alloys
  • Demographic Cohorts
  • High Density
  • High Resolution
  • High Temperature
  • Hypersonic Weapons
  • Indium
  • Indium Alloys
  • Inks
  • Materials
  • Nanoparticles
  • Nickel Alloys
  • Packaging
  • Particle Size
  • Particles
  • Printing
  • Quantum Computing
  • Unified Combatant Commands

Readers

  • Integrated Circuit Design and Technology.
  • Nanoscale Plasmonic Nanotechnology
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Biotechnology
  • Microelectronics
  • Quantum Computing