Enhancing Thermal Transport at Solid-Solid Interfaces
Abstract
The objective of this proposal is to significantly advance the fundamental knowledge of interfacial thermal transport, enabling the rational design of thermal interfaces with ultralow thermal interface resistance for efficient cooling of electronics. The specific objectives are 1. Formulate acomprehensive atomistic Green's function (AGF) model: Detailed information of interface transmittance can unveil the underlying processes that occur at interfaces, which, together with phonon transport processes in bulk materials, will complete the picture of phonon transport. 2. Develop a new measurement approach: To validate the simulation results, we will introduce a new technique for interfacial thermal measurement -- transient thermal grating (TTG) spectroscopy, which probes thermal transport at the interfaces with high sensitivity.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 28, 2022
- Accession Number
- AD1158236
Entities
People
- Zhiting Tian
Organizations
- Cornell University